LIDAR, RADAR, CAMERAS? WHY TESLA THINKS LESS IS MORE (PART 1)

LIDAR, RADAR, CAMERAS? WHY TESLA THINKS LESS IS MORE (PART 1)

Last week, Tesla announced a new hardware setup for future Model 3 and Model Y vehicles based solely around cameras instead of the previous setup that used cameras and radar sensors. This is a step away from virtually all other autonomous vehicle producers, which are developing their hardware suites using lidar sensors – something Tesla […]

A 5-STEP MATERIALS SELECTION METHOD FOR PRODUCT DESIGN

A 5-STEP MATERIALS SELECTION METHOD FOR PRODUCT DESIGN

On January 28, 1986, the Challenger shuttle exploded 72 seconds into its launch. Besides organizational mismanagement and miscommunication involved in the infamous launch, a technical investigation homed in on the failure of the O-Ring seals within the rockets. The O-rings were made of FKM, a common thermoset elastomer used in sealing applications across several industries. […]

THE ELECTRONICS ACHILLES HEEL (ELECTRONICS PACKAGING ASSEMBLY #3)

THE ELECTRONICS ACHILLES HEEL (ELECTRONICS PACKAGING ASSEMBLY #3)-ol

As consumers, we tend to think of our electronic devices in a rather static manner. If it works today, it should work tomorrow and in a year – so long as it is protected and used properly. However, a little engineering perspective informs us that this is not the case. In reality, even “normal” usage […]

CHOOSE THE BEST ENTITY TYPE FOR YOUR NEW BUSINESS

CHOOSE THE BEST ENTITY TYPE FOR YOUR NEW BUSINESS-ol

If you’re interested in launching a new business or product line, you will inevitably need to choose the best legal entity type. This comes up in my line of work, where I interact with the leadership of many early startups and growing companies who will make or have recently made a decision like this. Your […]

WIRE BOND VS FLIP CHIP (ELECTRONICS PACKAGING ASSEMBLY #2)

WIRE BOND VS FLIP CHIP (ELECTRONICS PACKAGING ASSEMBLY #2)

As we discussed in the previous post, “Assembly” in electronics generally refers to method by which structure and interconnects are formed between the IC and its substrate. Assembly technologies serve several purposes. First, assemblies provide electrical connections between the IC and the substrate for signals and power. Additionally, assemblies provide a mechanical support for the fragile […]

WHAT IS AN ELECTRONIC SYSTEM? (ELECTRONICS PACKAGING ASSEMBLY #1)

WHAT IS AN ELECTRONIC SYSTEM? (ELECTRONICS PACKAGING ASSEMBLY #1)

In this series, I will be going in depth on the topic of Electronics Packaging Assembly. As engineers and product designers, this is important to understand as it informs our design decisions in products which contain electronic components and helps us forecast the future of the electronics industry. Before I can introduce Electronics Packaging Assembly, […]